Sources: Intel and Italy are close to clinching a deal initially worth $5B to build an advanced semiconductor packaging and assembly plant in the country (Reuters) | Techland

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Reuters:
Sources: Intel and Italy are close to clinching a deal initially worth $5B to build an advanced semiconductor packaging and assembly plant in the country — Italy is close to clinching a deal initially worth $5 billion with Intel (INTC.O) to build an advanced semiconductor packaging …